High Performance (Polyimide)
Polyimide laminates, prepregs and hole filling materials for high performance, high Tg multilayer printed circuit boards.
Isola offers a product line of polyimide-based prepreg (P25) and core material (P95) for high temperature printed circuit applications.
These products consist of an HB flammability rated polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Isola offers a product line of polyimide-based prepreg (P26) and core material (P96) for high temperature printed circuit applications. These products consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend system, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
