Isola Laminates and Prepregs
RoHS compliant copper clad laminates, including dicy-free laminates for lead free PCB assembly, polyimide laminates for high performance multilayer PCBs, high frequency and microwave materials and aramid reinforced electronic substrates.
Isola offers the FR406N family of no-flow and low-flow prepregs, consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
185HR laminate and prepreg materials are a proprietary, high-performance resin system with a Tg of 180°C for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.
185HR laminate and prepreg materials are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 340°C decomposition temperature, a lower Z-axis expansion and offers lower loss compared to competitive products in this space. The 185HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimageable solder mask imaging.
Astra MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. Astra MT is suitable for many of taday’s high speed digital and RF/microwave printed circuit designs. It features a Dielectric Constant (Dk) that is stable between -55C and 125C, up to 20 GHz. In addition, Astra MT offers a lower dissipation factor (Df) of 0.0017 making it a cost effective alternative to PTFE and other commercial microwave and high speed dgital laminate materials. Key applications include long antennas and radar applications for automobiles, such as adaptive cruise control, pre-crash, blind spot detection, lane departure warning and stop and go systems.
DE104 offers excellent thermal resistance, due to the special resin system and the low coefficient of thermal expansion in the Z-axis, enabling a lifespan of up to 1000 cycles at temperature change(-40C to +125C) and the abilit to withstand up to 10 cycles of lead-free soldering
FR408HR is a proprietary high-performance 230C (DMA) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. FR408HR laminate and prepreg products are manufactured with Isola’s patentable high performance multi-functional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The FR408HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo-imagable solder mask imaging.
I-Speed is a proprietary high performance 180C glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. I-Speed laminate and prepreg products are manufactured with Isola’s patentable high performance multi-functional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 15% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The I-Speed system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimagable solder mask imaging.
I-Terra MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. I-Terra MT is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Terra MT features a Dielectric Constant (Dk) that is stable between -55C and 125C, up to 20 GHz. In addition, I-Terra MT offers a lower dissipation factor (Df) of 0.0036 making it a cost effective alternative to PTFE and other commercial microwave and high speed digital laminate materials. I-Terra MT laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-terra MT does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.
I-Tera® MT40 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a lower dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.
I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.
IS400 is a temperature-resistant base material with low Z-axis expansion. The product is based on a proprietary filled epoxy system with a nominal TG of approximately 150C and a delamination time at 260C of about 60 mins. The Coefficient of Thermal Expansion in the Z-axis lies between room temperature and 120C at 30-40 ppm/K compared to unfilled systems at 60-70 ppm/K:
- IPC-4101/101
- Td 5% 330C
- copper foil standard – HTE Grade 3, RTF available
- E glass standard, Square weave glass fabric available
- UL File Number E41625
IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead-free solder. Isola’s IS410 has a glass transition temperature (Tg) of 180C and is specially formulated for superior performance through multiple thermal excursions., passing 6x solder tests at 288C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of <= 10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long term reliability of boards built wth small feature designs.
IS680 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. IS680 is suitable for many of taday’s high speed digital and RF/microwave printed circuit designs. It features a Dielectric Constant (Dk) that is stable between -55C and 125C, up to 20 GHz. In addition, IS680 offers a lower dissipation factor (Df) of 0.003 making it a cost effective alternative to PTFE and other commercial microwave and high speed dgital laminate materials.
IS680 AG laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
IS680 AG is suitable for many of today’s commercial RF/ microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In addition, IS680 AG offers an ultra-low dissipation factor (Df), making it an extremely cost-effective alternative to PTFE and other commercial microwave laminate materials in double sided applications.
