Isola Laminates and Prepregs
RoHS compliant copper clad laminates, including dicy-free laminates for lead free PCB assembly, polyimide laminates for high performance multilayer PCBs, high frequency and microwave materials and aramid reinforced electronic substrates.
Isola offers a P25N product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications.
These products consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset
polyimides.
Isola offers a product line of polyimide-based prepreg (P25) and core material (P95) for high temperature printed circuit applications.
These products consist of an HB flammability rated polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Isola offers a product line of polyimide-based prepreg (P26) and core material (P96) for high temperature printed circuit applications. These products consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend system, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Tachyon 100G laminate materials are designed for very high-speed digital applications up to and beyond data rates of 100 Gb/s.
Tachyon 100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100 GHz. These electrical properties provide designers a scalable solution for next generation designs of backplanes and daughter cards, enabling 10x improvements from 10 Gb/s data rates.
Isola has developed Tachyon 100G with the highest level of thermal performance for high layer count line cards. The very low Z-axis CTE makes it a perfect choice for fine pitch BGA applications of 0.8 mm or less. The material is optimized with the use of spread glass to mitigate skew, improve rise times, reduce jitter, and increase eye width/height and that use ultra smooth VLP2 (2um Rz) copper that significantly reduces conductor losses.
TerraGreen laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. TerraGreen is engineered for such high performance applications as power amplifier boards for 4G LTE base stations, internet infrastrucure and cloud computing. TerraGreen features a Dielectric Constant (Dk) that is stable between -55C and 125C, up to 20 GHz.
TerraGreen is a lead-free assembly mareial and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear and the prepreg shelf life is similar to FR-4 materials. TerraGreen is suitable for high-layer count, high-speed digital, backplanes and is compatible with Isola’s FR-4 materials for hybrid designs. TerraGreen meets UL 94 V-0 and is halogen free.
The PCL-FRP-370HR family of no flow prepregs consisting
of proprietary resin system specifically formulated for optimal
performance in bonding applications requiring minimal resin flow
and consistency in lamination.
