No Flow Prepregs
A range of epoxy and polyimide prepregs with controlled flow properties for heat sink bonding and flex-rigid multilayer applications.
Isola offers the FR406N family of no-flow and low-flow prepregs, consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
Isola offers a P25N product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications.
These products consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset
polyimides.
The PCL-FRP-370HR family of no flow prepregs consisting
of proprietary resin system specifically formulated for optimal
performance in bonding applications requiring minimal resin flow
and consistency in lamination.
