Soldermask
Photoimageable and heat cured solder mask inks designed for flexible and also rigid PCBs.
370HR is a high performance 180C glass transition (Tg) system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. 370HR laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glas) glass fabric. The system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability. In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The 370HR system is also laser fluoescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimagable solder mask imaging. 370HR has proven to be best in class for sequential lamination designs.
Flex solder mask NPR-5/NBD is a flexible solder mask for flexible printed circuit boards and TAB applications. This product has excellent flexible/bending characteristics and flammable resistance.
Flex Photoimage Mask NPR-80/ID100 series is a developed 2-component system alkaline – developing photoresist ink of worldwide reputation. The products have low tackiness and good reliability. These are designed to meet the recently increasing market trends/needs for fine pitch, high density circuitry fabrications of flexible printed circuit boards (PCBs).
Flex Photoimage Mask NPR-80/ID60 series is a developed 2-component system alkaline – developing photoresist ink with UL V-0 of worldwide reputation. The products have low tackiness and good reliability. These are designed to meet the recently increasing market trends/needs for fine pitch, high density circuitry fabrications of flexible printed circuit boards (PCBs).
