Thermally Reliable Epoxy Materials
Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Such applications include automotive, aerospace, military, down-well drilling and even telecommunications infrastructure equipment in outdoor operating environments.
185HR laminate and prepreg materials are a proprietary, high-performance resin system with a Tg of 180°C for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.
185HR laminate and prepreg materials are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 340°C decomposition temperature, a lower Z-axis expansion and offers lower loss compared to competitive products in this space. The 185HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimageable solder mask imaging.
Astra MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. Astra MT is suitable for many of taday’s high speed digital and RF/microwave printed circuit designs. It features a Dielectric Constant (Dk) that is stable between -55C and 125C, up to 20 GHz. In addition, Astra MT offers a lower dissipation factor (Df) of 0.0017 making it a cost effective alternative to PTFE and other commercial microwave and high speed dgital laminate materials. Key applications include long antennas and radar applications for automobiles, such as adaptive cruise control, pre-crash, blind spot detection, lane departure warning and stop and go systems.
IS400 is a temperature-resistant base material with low Z-axis expansion. The product is based on a proprietary filled epoxy system with a nominal TG of approximately 150C and a delamination time at 260C of about 60 mins. The Coefficient of Thermal Expansion in the Z-axis lies between room temperature and 120C at 30-40 ppm/K compared to unfilled systems at 60-70 ppm/K:
- IPC-4101/101
- Td 5% 330C
- copper foil standard – HTE Grade 3, RTF available
- E glass standard, Square weave glass fabric available
- UL File Number E41625
IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead-free solder. Isola’s IS410 has a glass transition temperature (Tg) of 180C and is specially formulated for superior performance through multiple thermal excursions., passing 6x solder tests at 288C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of <= 10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long term reliability of boards built wth small feature designs.
